Papers


       Patents  
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77개 항목 표시
번호논문명저자게재지(권,쪽)게재년도
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번호논문명저자게재지(권,쪽)게재년도
FORMATION OF PbTe INTERMETALLIC COMPOUND BY MECHANICAL ALLOYING OF ELEMENTAL Pb AND Te POWDERS T.S Oh, J.S Choi and D.B Hyun Scripta Metallurgica et Materialia 32, 4, 595-600  1995 
Effects of Mechanical Properties of Metal Films on The Adhesion Strength of Cr/Polyimide Interfaces J.W Choi and T.S Oh MRS Proceedings Volume 436MRS Proceedings Volume 436 1996 
Thermoelectric Properties of P-Type (Bi1−xSbx)2Te3 Fabricated by Mechanical Alloying Process B.Y Jung, J.S Choi, T.S Oh and D.B Hyun MRS Proceedings, 478, 121 doi:10.1557/PROC-478-121 1997 
Thermoelectric Properties of N-Type Bi2(Tel−xSex)3 Fabricated by Mechanical Alloying and Hot Pressing H.J Kim, J.S Choi, T.S Oh and D.B Hyun MRS Proceedings, 478, 151 doi:10.1557/PROC-478-151. 1997 
Thermoelectric Properties of (Bi0:25Sb0:75)2Te3 Prepared by Mechanical Alloying and Hot Pressing B.Y Jung, T.S Oh, D.B Hyun and J.D Shim Journal of the Korean Physical Society, 31 219-222  1997 
Effects of a Reduction Treatment and Te Doping on Thermoelectric Properties of J.S Choi, H.J Kim, D.B Hyun, T.S Oh and H.C Kim 16th International Conference on Thermoelectrics  1997 
Comparisons of the Thermoelectric Properties of n-Type PbTe Fabricated with Different Powder Processing Methods J.S Choi, H.J Kim, D.B Hyun, T.S Oh and H.C Kim 16th International Conference on Thermoelectrics  1997 
Thermoelectric properties of n-type (Pb1-xGex)Te fabricated by hot pressing method H.J Kim, H.C Kim. T.S Oh, D.B Hyun, H.W Lee and J.S Choi 16th International Conference on Thermoelectrics 1997 
Thermoelectric properties of p-type (Bi,Sb)2Te3 alloys fabricated by the hot pressing method H.J Kim,H.C Kim, T.S Oh and D.B Hyun Metals and Materials, 4, 1, 75-81  1998 
10 Electrical properties of the 85% Bi2Te3-15% Bi2Se3 thermoelectric material doped with SbI3 and CuBr D.B Hyun, J.S Hwang, B.C You, T.S Oh and C.W Hwang Journal of Physics and Chemical Solids 59 1039-1044 1998 
11 Thermoelectric Properties of the Hot-Pressed Bi{sub 2}(Te{sub 1-x}Se{sub x}){sub 3} Alloys with the Bi{sub 2}Se{sub 3} Content T.S Oh and D.B Hyun Hangug Jaeryohag Hoeji (Korean Journal of Materials Research) Volume 8 pp. 408-412 1998 
12 Thermoelectric properties of p-type (Bi,Sb)2Te3 alloys fabricated by the hot pressing method H.C Kim, H,J Kim, T.S Oh and D.B Hyun Metals and Materials Volume 4, pp 75-81  1998 
13 Evaluation of the micro-phase diagram near the stoichiometric composition of the Bi2Te3-Sb2Te3 alloys  J.S Hwang, J.D Shim, T.S Oh and D.B Hyun  Proceedings ICT 98. XVII International Conference on 1998 
14 Comparison of the thermoelectric properties of (Bi,Sb)2Te3 alloys prepared by powder metallurgy with single crystals  H.C Kim, J.S Lee T.S Oh and D.B Hyun  Proceedings ICT 98. XVII International Conference on pages 125 - 128  1998 
15 Thermoelectric properties of the hot-pressed Bi2(Te,Se) 3 alloys with the Bi2Se3 content and addition of scattering center  S.K Lee, D.B Hyun, T.S Oh and H.C Kim Proceedings ICT 98. XVII International Conference on  1998 
16 Thermoelectric properties of the 0.05 wt.% SbI3-Doped n-Type Bi2(Te0. 95Se0. 05)3 alloy fabricated by the hot pressing method S.K Lee, D.B Hyun, T.S Oh and H.C Kim Metals and Materials Volume 6, pp 67-71  2000 
17 Thermoelectric properties of the p-type Bi2Te3-Sb2Te3-Sb2Se3 alloys fabricated by mechanical alloying and hot pressing D.B Hyun, T.S Oh and H.C Kim The Journal of physics and chemistry of solids ISSN 0022-3697 2000 
18 Adhesion Strength and Peeling Angle Measured on the Polyimide/Cr Interfaces J.W Choi, K.E Lee and T.S Oh MRS Spring Meeting Volume 629 2000 
19 Characteristics of the MFIS-FET Structures Processed Using SBT Ferroelectric Thin Films J.W Kim, J.D Park and T.S Oh  Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on 2000 
20 Thermoelectric properties of the hot-pressed (Bi0.2Sb0.8)2Te3 alloy with addition of BN and WO3 powders J.S Lee, T.S Oh and D.B Hyun JOURNAL OF MATERIALS SCIENCE 35 881–887  2000 
21 Effects of the Sr content on the ferroelectric characteristics of Srx Bi2.4Ta2O9 films J.W Kim, J.H Choi and T.S Oh JOURNAL OF MATERIALS SCIENCE LETTERS 19, 1693 – 1696  2000 
22 Electrical Characteristics of LSMCD-Derived SrBi2.4Ta2O9 Thin Films Using TiO2 Buffer Layer for Metal/Ferroelectric/Insulator/Semiconductor Field Effect Transistor Devices J.D Park and T.S Oh MRS Proceedings, 623, 31 doi:10.1557/PROC-623-31. 2000 
23 Electrical characteristics of the MOD-derived SrBi2xTa2O9 and SrBi2.4(Ta,Nb)2O9 thin films D.J Yeon, J.D Park, Y.W Kwon and T.S Oh JOURNAL OF MATERIALS SCIENCE 35 2405 – 2411  2000 
24 Thermoelectric properties of the p-type Bi2Te3–Sb2Te3–Sb2Se3 alloys fabricated by mechanical alloying and hot pressing H.C Kim, OT.S Oh and D.B Hyun Journal of Physics and Chemistry of Solids Volume 61, Pages 743–749 2000 
25 Ferroelectric characteristics of liquid source misted chemical deposition LSMCD. -derived SrBi Ta O thin films with 2.4 2 9 thickness variation J.D Park, J.H Lee, J.Y Park and T.S Oh Thin Solid Films 379 183-187  2000 
26 Peel strength and peel angle measured by the T-peel test on Cr/BPDA-PDA interfaces J.W Choi and T.S Oh Journal of Adhesion Science Technology, 15, 139–152  2001 
27 Characteristics of Pt/SBT/ZrO2/Si structure for metal ferroelectric insulator semiconductor field effect transistor applications J.D Park and T.S Oh Integrated Ferroelectrics: An International Journal Volume 34 2001 
28 Dielectric Properties and Leakage Current Characteristics of Al2O3 Thin Films with Thickness Variation J.W Kim, J.H Choi and T.S Oh MRS Spring Meeting Volume 666 2001 
29 Thickness dependence of the ferroelectric characteristics of SBT and SBTN thin film J.D Park and T.S Oh Integrated Ferroelectrics: An International Journal Volume 33 2001 
30 Thermoelectric properties of (Bi0.25Sb0.75)2Te3 alloys fabricated by hot-pressing method D.B Hyun, J.S Hwang, J.D Shim and T.S Oh JOURNAL OF MATERIALS SCIENCE 36 1285–1291 2001 
31 Electrical Characteristics of the Pt/SBT/TiO2/Si MFIS Structures with Thickness Variation of the SBT Film J.W Kim, K.Y Lee, J.H Choi and T.S Oh MRS Proceedings, 666, F3.1 doi:10.1557/PROC-666-F3.1. 2001 
32 Effects of excess Te on the thermoelectric properties of p-type 25% Bi2Te3-75% Sb2Te3 single crystal and hot-pressed sinter C.W Hwang, D.B Hyun, H.P Ha and T.S Oh Journal of Materials Science Volume 36, Issue 13 , pp 3291-3297 2001 
33 FERROELECTRIC CHARACTERISTICS OF THE LSMCD-DERIVED SrBi2.4Ta209 THIN FILMS J.D Park, J.W Kim and T.S Oh Ferroelectrics, 260, 291 -296  2001 
34 Dielectric Properties and Leakage Current Characteristics of Al2O3 Thin Films with Thickness Variation J.H Choi, J.W Kim and T.S Oh MRS Proceedings Volume 666 2001 
35 Characteristics of Pt/SBT/Al2O3/Si Structures for MFIS-FET Applications J.H Choi, J.W Kim and T.S Oh  MRS Spring Meeting. Volume 666  2001 
36 Shear Strength and Aging Characteristics of Sn-Pb and Sn-Ag-Bi Solder Bumps J.W Choi and T.S Oh Int'l Symposium on Electronic Materials and Packaging  2001 
37 Characteristics of' PtlSBT/ZrO2/Si Structure for Metal Ferroelectric Insulator Semiconductor Field Effect Transistor Applications J.D Park and T.S Oh Integrated Ferroelectrics, 34, 121-130  2001 
38 Electrical Characteristics of the Pt/SrBi2:4Ta2O9/ZrO2/Si Structure for Metal-Ferroelectric-Insulator-Semiconductor Field-Effect-Transistor Application J.H Choi, J.D Park and T.S Oh Japanese Journal of Applied Physics 41 5645–5649  2002 
39 Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys J.W Choi, H.S Cha and T.S Oh Materials Transactions 43 1864-1867  2002 
40 Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–-Cu solder and thin film metallization J.S Ha, T.S Oh and K.N Tu Journal of Materials Research 18, 9  2003 
41 Electrical properties of the Pt/Sr0.85Bi2.4Ta2O9/TiO2/Si structure with variation of the Sr0.85Bi2.4Ta2O9 film thickness J.W Kim, J.D Park, J.H Choi and T.S Oh JOURNAL OF MATERIALS SCIENCE LETTERS 22, 535–537  2003 
42 Fabrication of tin oxide film by sol–.gel method for photovoltaic solar cell system J.H Lee, T.S Oh, Y.H Kim and S.C Lee Solar Energy Materials & Solar Cells 75 481–487 2003 
43 Electrical characteristics of Srx Bi2.4Ta2O9 thin film and Pt/Sr0.85Bi2.4Ta2O9/Al2O3/Si structure J.W Kim, J.H Choi and T.S Oh OURNAL OF MATERIALS SCIENCE 38 1853 – 1857  2003 
44 Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes J.W Choi, H.S Cha and T.S Oh Metals and Materials International, 9, 3, 273-278  2003 
45 Reaction between Sn-In Solder and Under Bump Metallurgy J.H. Choi, B.Y. Jung, S.W. Jun, Y.H Kim, T.S Oh  Materials Science Forum 449-452, 401-404  2004 
46 Ferroelectric Characteristics of SrxBi2.4Ta2O9 Thin Films and Electrical Properties of the Pt/SrxBi2.4Ta2O9/TiO2/Si Structure  J.H. Choi, T.S Oh  Materials Science Forum, 449-452, 477-480  2004 
47 Electrodeposition of Bi2Te3 for Nanowire Application Y.H. Lee, K.Y Lee, J.S Bae, J.H Lee, J.Y Byun, D.B. Hyun and T.S Oh  Materials Science Forum, 449-452, 377-380 2004 
49 Effects of Hydrogen Annealing on the Thermoelectric Properties of Electrodeposited Bi2Te3 for Nanowire Applications S.W Jun, K.Y Lee and T.S Oh  Journal of Korean Physical Society 48 1708 2005 
50 Contact Resistance of the Chip-on-Glass Bonded 48Sn–.52In Solder Joint J.H Choi, K.Y Lee, S.W Jun, Y.H Kim and T.S Oh MATERIALS TRANSACTIONS 46(5) 1042-1046 2005 
51 Low Temperature and Ultra Fine Pitch Joints Using Non-Conductive Adhesive for Flip Chip Technology W.J Lee, Y.H Kim, T.S Oh and S.Y Kim 7th International Conference on Electronics Packaging Technology  2006 
52 Fabrication and Evaluation of 3D Packages with Through Hole Via D.M Jang, K.Y Lee, C.H Ryu, B.H Cho, T.S Oh, J.H Kim, W.J Lee and Jin Yu MRS Proceedings Volume 970 2006 
53 P-Type and N-Type Bi2Te3/PbTe Functional Gradient Materials for Thermoelectric Power Generation K.Y Lee and T.S Oh Materials Science Forum 534-536, 1493-1496  2007 
54 Effects of the Additives and Current Density on the Electrodeposition Behavior and Mechanical Properties of the Ni-SiC Composite Coatings T.S Oh, J.H Lee, J.Y Byun and T.S Oh Key Engineering Materials 345-346 1533-1536 2007 
55 Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias K.Y Lee, T.S Oh, J.H Lee and T.S Oh Journal of Electronic Materials , Volume 36, Issue 2, pp 123-128 2007 
56 Bump Formation and Flip Chip Processes for RF System B.Y Jung, E.K Choi, Y.S Jeon, K.Y Lee, K.S Seo and T.S Oh  Solid State Phenomena 124-126, 25-28  2007 
56 Bump Formation and Flip Chip Processes for RF System B.Y Jung, E.K Choi, Y.S Jeon, K.Y Lee, K.S Seo and T.S Oh  Solid State Phenomena 124-126, 25-28  2007 
57 Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV) D.M Jang, C.H Ryul, K.Y Lee, B.H Cho, J.H Kim, T.S Oh, W.J Lee and Jin Yu Electronic Components and Technology Conference 2007 
58 Thermoelectric Characteristics of the Electrodeposited (Bi,Sb)2Te3 Films with Variation of the Electrodeposition Current Density T.J Yoon, Y.H Park and T.S Oh  Materials Science Forum 544-545, 917-920  2007 
59 Thermoelectric properties of the bismuth–antimony–telluride and the antimony–telluride films processed by electrodeposition for micro-device applications S.K Lim, M.Y Kim and T.S Oh  The proceedings of the 1st International Conference on Microelectronics and Plasma Technology (ICMAP 2008) Volume 517 2008 
60 Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process E.K. Choi, K.Y Lee and T.S Oh 14th International Symposium on Intercalation Compounds — ISIC 14 2008 
61 Electrodeposition and mechanical properties of Ni–carbon nanotube nanocomposite coatings Y.S. Jeon, J.Y Byun and T.S Oh Journal of Physics and Chemistry of Solids 69 1391–1394  2008 
62 Flip-chip process using heat transfer from an induction-heating film K.Y Lee, Y.H Lee, B.Y Jungand T.S Oh Metals and Materials International, 15, 3, 479-485  2009 
63 Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package Y. K. Jee, J Yu, K.W Park and T.S Oh Journal of Electronic Materials Volume 38, Issue 5, pp 685-690 2009 
64 Thermoelectric Characteristics of p-Type (Bi,Sb)2Te3/(Pb,Sn)Te Functional Gradient Materials with Variation of the Segment Ratio T.S Oh Journal of Electronic Materials Volume 38, pp 1041-1047 2009 
65 Crystallization behavior and thermoelectric characteristics of the electrodeposited Sb2Te3 thin films M.Y Kim and T.S Oh Proceedings of the 2nd International Conference on Microelectronics and Plasma Technology – ICMAP 2009 Volume 518 2009 
66 Flip-Chip Process Using Interlocking-Bump Joints K.Y Lee, H.J Won and T.S Oh Components and Packaging Technologies, IEEE Transactions on Volume:32 2009 
67 Crystallization behavior and thermoelectric characteristics of the electrodeposited Sb2Te3 thin films M.Y Park and T.S Oh Thin Solid Films Volume 518 Pages 6550–6553 2010 
68 Thermoelectric energy-conversion characteristics of n-type Bi2(Te,Se)3 nanocomposites processed with carbon nanotube dispersion D.H Park, M.Y Park and T.S Oh International Conference on Electronic Materials and Nanotechnology for Green Environment Volume 11, Supplement,Pages S41–S45 2011 
69 Processing and Thermoelectric Performance Characterization of Thin-Film Devices Consisting of Electrodeposited Bismuth Telluride and Antimony Telluride Thin-Film Legs M.Y Park and T.S Oh Journal of Electronic Materials Volume 40 pp 759-764 2011 
70 Electrodeposition behavior and characteristics of Ni-carbon nanotube composite coatings S.K Kim and T.S Oh Transactions of Nonferrous Metals Society of China 21, 1, s68-s72  2011 
71 Carbon dioxide sensitivity of La-doped thick film tin oxide gas sensor  M.Y Park, J.M Bae and T.S Oh The 7th Asian Meeting on Electroceramics (AMEC-7) in conjunction with the 7th Asian Meeting on Ferroelectricity (AMF-7) Volume 38, Supplement 1, Pages S657–S660 2012 
72 Thermoelectric characteristics of the (Bi,Sb)2(Te,Se)3 nanocomposites processed with nanoparticle dispersion Y.H Yoe, D.H Park, M.Y Park and T.S Oh The 7th Asian Meeting on Electroceramics (AMEC-7) in conjunction with the 7th Asian Meeting on Ferroelectricity (AMF-7) Volume 38, Supplement 1, Pages S529–S533 2012 
73 CO sensitivity of La2O3-doped SnO2 thick film gas sensor J.Y Choi and T.S Oh roceedings of the 4th International Conference on Microelectronics and Plasma Technology (ICMAP 2012) Volume 547, Pages 230–234 2013 
74 Thermoelectric Power Generation Characteristics of a Thin-Film Device Consisting of Electrodeposited n-Bi2Te3 and p-Sb2Te3 Thin-Film Legs M.Y Park and T.S Oh Journal of Electronic Materials Volume 42, pp 2752-2757 2013 
75 The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode Package T. Joeng, J.S Ha, M.Y Park and T.S Oh Journal of Electronic Materials Volume 43, pp 630-635 2014 
76 Preparation and Characterization of Bi2Te3/Sb2Te3 Thermoelectric Thin-Film Devices for Power Generation M.Y Park and T.S Oh Journal of Electronic Materials Volume 43, pp 1933-1939 2014 
77 Thermoelectric properties of p-type (Bi,Sb)2Te3 nanocomposites dispersed with multiwall carbon nanotubes Y.H Yoe and T.S Oh Proceedings of the IFFM2013 - Vol. 1: Fundamentals of the functional materials and Vol. 2: Applications of the functional materials Volume 58, Pages 54–58 2014 
77개 항목 표시
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