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Papers
| 번호 | 논문명 | 저자 | 게재지(권,쪽) | 게재년도 |
|---|---|---|---|---|
| 1 | FORMATION OF PbTe INTERMETALLIC COMPOUND BY MECHANICAL ALLOYING OF ELEMENTAL Pb AND Te POWDERS | T.S Oh, J.S Choi and D.B Hyun | Scripta Metallurgica et Materialia 32, 4, 595-600 | 1995 |
| 2 | Effects of Mechanical Properties of Metal Films on The Adhesion Strength of Cr/Polyimide Interfaces | J.W Choi and T.S Oh | MRS Proceedings Volume 436MRS Proceedings Volume 436 | 1996 |
| 3 | Thermoelectric Properties of P-Type (Bi1−xSbx)2Te3 Fabricated by Mechanical Alloying Process | B.Y Jung, J.S Choi, T.S Oh and D.B Hyun | MRS Proceedings, 478, 121 doi:10.1557/PROC-478-121 | 1997 |
| 4 | Thermoelectric Properties of N-Type Bi2(Tel−xSex)3 Fabricated by Mechanical Alloying and Hot Pressing | H.J Kim, J.S Choi, T.S Oh and D.B Hyun | MRS Proceedings, 478, 151 doi:10.1557/PROC-478-151. | 1997 |
| 5 | Thermoelectric Properties of (Bi0:25Sb0:75)2Te3 Prepared by Mechanical Alloying and Hot Pressing | B.Y Jung, T.S Oh, D.B Hyun and J.D Shim | Journal of the Korean Physical Society, 31 219-222 | 1997 |
| 6 | Effects of a Reduction Treatment and Te Doping on Thermoelectric Properties of | J.S Choi, H.J Kim, D.B Hyun, T.S Oh and H.C Kim | 16th International Conference on Thermoelectrics | 1997 |
| 7 | Comparisons of the Thermoelectric Properties of n-Type PbTe Fabricated with Different Powder Processing Methods | J.S Choi, H.J Kim, D.B Hyun, T.S Oh and H.C Kim | 16th International Conference on Thermoelectrics | 1997 |
| 8 | Thermoelectric properties of n-type (Pb1-xGex)Te fabricated by hot pressing method | H.J Kim, H.C Kim. T.S Oh, D.B Hyun, H.W Lee and J.S Choi | 16th International Conference on Thermoelectrics | 1997 |
| 9 | Thermoelectric properties of p-type (Bi,Sb)2Te3 alloys fabricated by the hot pressing method | H.J Kim,H.C Kim, T.S Oh and D.B Hyun | Metals and Materials, 4, 1, 75-81 | 1998 |
| 10 | Electrical properties of the 85% Bi2Te3-15% Bi2Se3 thermoelectric material doped with SbI3 and CuBr | D.B Hyun, J.S Hwang, B.C You, T.S Oh and C.W Hwang | Journal of Physics and Chemical Solids 59 1039-1044 | 1998 |
| 11 | Thermoelectric Properties of the Hot-Pressed Bi{sub 2}(Te{sub 1-x}Se{sub x}){sub 3} Alloys with the Bi{sub 2}Se{sub 3} Content | T.S Oh and D.B Hyun | Hangug Jaeryohag Hoeji (Korean Journal of Materials Research) Volume 8 pp. 408-412 | 1998 |
| 12 | Thermoelectric properties of p-type (Bi,Sb)2Te3 alloys fabricated by the hot pressing method | H.C Kim, H,J Kim, T.S Oh and D.B Hyun | Metals and Materials Volume 4, pp 75-81 | 1998 |
| 13 | Evaluation of the micro-phase diagram near the stoichiometric composition of the Bi2Te3-Sb2Te3 alloys | J.S Hwang, J.D Shim, T.S Oh and D.B Hyun | Proceedings ICT 98. XVII International Conference on | 1998 |
| 14 | Comparison of the thermoelectric properties of (Bi,Sb)2Te3 alloys prepared by powder metallurgy with single crystals | H.C Kim, J.S Lee T.S Oh and D.B Hyun | Proceedings ICT 98. XVII International Conference on pages 125 - 128 | 1998 |
| 15 | Thermoelectric properties of the hot-pressed Bi2(Te,Se) 3 alloys with the Bi2Se3 content and addition of scattering center | S.K Lee, D.B Hyun, T.S Oh and H.C Kim | Proceedings ICT 98. XVII International Conference on | 1998 |
| 16 | Thermoelectric properties of the 0.05 wt.% SbI3-Doped n-Type Bi2(Te0. 95Se0. 05)3 alloy fabricated by the hot pressing method | S.K Lee, D.B Hyun, T.S Oh and H.C Kim | Metals and Materials Volume 6, pp 67-71 | 2000 |
| 17 | Thermoelectric properties of the p-type Bi2Te3-Sb2Te3-Sb2Se3 alloys fabricated by mechanical alloying and hot pressing | D.B Hyun, T.S Oh and H.C Kim | The Journal of physics and chemistry of solids ISSN 0022-3697 | 2000 |
| 18 | Adhesion Strength and Peeling Angle Measured on the Polyimide/Cr Interfaces | J.W Choi, K.E Lee and T.S Oh | MRS Spring Meeting Volume 629 | 2000 |
| 19 | Characteristics of the MFIS-FET Structures Processed Using SBT Ferroelectric Thin Films | J.W Kim, J.D Park and T.S Oh | Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on | 2000 |
| 20 | Thermoelectric properties of the hot-pressed (Bi0.2Sb0.8)2Te3 alloy with addition of BN and WO3 powders | J.S Lee, T.S Oh and D.B Hyun | JOURNAL OF MATERIALS SCIENCE 35 881–887 | 2000 |
| 21 | Effects of the Sr content on the ferroelectric characteristics of Srx Bi2.4Ta2O9 films | J.W Kim, J.H Choi and T.S Oh | JOURNAL OF MATERIALS SCIENCE LETTERS 19, 1693 – 1696 | 2000 |
| 22 | Electrical Characteristics of LSMCD-Derived SrBi2.4Ta2O9 Thin Films Using TiO2 Buffer Layer for Metal/Ferroelectric/Insulator/Semiconductor Field Effect Transistor Devices | J.D Park and T.S Oh | MRS Proceedings, 623, 31 doi:10.1557/PROC-623-31. | 2000 |
| 23 | Electrical characteristics of the MOD-derived SrBi2xTa2O9 and SrBi2.4(Ta,Nb)2O9 thin films | D.J Yeon, J.D Park, Y.W Kwon and T.S Oh | JOURNAL OF MATERIALS SCIENCE 35 2405 – 2411 | 2000 |
| 24 | Thermoelectric properties of the p-type Bi2Te3–Sb2Te3–Sb2Se3 alloys fabricated by mechanical alloying and hot pressing | H.C Kim, OT.S Oh and D.B Hyun | Journal of Physics and Chemistry of Solids Volume 61, Pages 743–749 | 2000 |
| 25 | Ferroelectric characteristics of liquid source misted chemical deposition LSMCD. -derived SrBi Ta O thin films with 2.4 2 9 thickness variation | J.D Park, J.H Lee, J.Y Park and T.S Oh | Thin Solid Films 379 183-187 | 2000 |
| 26 | Peel strength and peel angle measured by the T-peel test on Cr/BPDA-PDA interfaces | J.W Choi and T.S Oh | Journal of Adhesion Science Technology, 15, 139–152 | 2001 |
| 27 | Characteristics of Pt/SBT/ZrO2/Si structure for metal ferroelectric insulator semiconductor field effect transistor applications | J.D Park and T.S Oh | Integrated Ferroelectrics: An International Journal Volume 34 | 2001 |
| 28 | Dielectric Properties and Leakage Current Characteristics of Al2O3 Thin Films with Thickness Variation | J.W Kim, J.H Choi and T.S Oh | MRS Spring Meeting Volume 666 | 2001 |
| 29 | Thickness dependence of the ferroelectric characteristics of SBT and SBTN thin film | J.D Park and T.S Oh | Integrated Ferroelectrics: An International Journal Volume 33 | 2001 |
| 30 | Thermoelectric properties of (Bi0.25Sb0.75)2Te3 alloys fabricated by hot-pressing method | D.B Hyun, J.S Hwang, J.D Shim and T.S Oh | JOURNAL OF MATERIALS SCIENCE 36 1285–1291 | 2001 |
| 31 | Electrical Characteristics of the Pt/SBT/TiO2/Si MFIS Structures with Thickness Variation of the SBT Film | J.W Kim, K.Y Lee, J.H Choi and T.S Oh | MRS Proceedings, 666, F3.1 doi:10.1557/PROC-666-F3.1. | 2001 |
| 32 | Effects of excess Te on the thermoelectric properties of p-type 25% Bi2Te3-75% Sb2Te3 single crystal and hot-pressed sinter | C.W Hwang, D.B Hyun, H.P Ha and T.S Oh | Journal of Materials Science Volume 36, Issue 13 , pp 3291-3297 | 2001 |
| 33 | FERROELECTRIC CHARACTERISTICS OF THE LSMCD-DERIVED SrBi2.4Ta209 THIN FILMS | J.D Park, J.W Kim and T.S Oh | Ferroelectrics, 260, 291 -296 | 2001 |
| 34 | Dielectric Properties and Leakage Current Characteristics of Al2O3 Thin Films with Thickness Variation | J.H Choi, J.W Kim and T.S Oh | MRS Proceedings Volume 666 | 2001 |
| 35 | Characteristics of Pt/SBT/Al2O3/Si Structures for MFIS-FET Applications | J.H Choi, J.W Kim and T.S Oh | MRS Spring Meeting. Volume 666 | 2001 |
| 36 | Shear Strength and Aging Characteristics of Sn-Pb and Sn-Ag-Bi Solder Bumps | J.W Choi and T.S Oh | Int'l Symposium on Electronic Materials and Packaging | 2001 |
| 37 | Characteristics of' PtlSBT/ZrO2/Si Structure for Metal Ferroelectric Insulator Semiconductor Field Effect Transistor Applications | J.D Park and T.S Oh | Integrated Ferroelectrics, 34, 121-130 | 2001 |
| 38 | Electrical Characteristics of the Pt/SrBi2:4Ta2O9/ZrO2/Si Structure for Metal-Ferroelectric-Insulator-Semiconductor Field-Effect-Transistor Application | J.H Choi, J.D Park and T.S Oh | Japanese Journal of Applied Physics 41 5645–5649 | 2002 |
| 39 | Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys | J.W Choi, H.S Cha and T.S Oh | Materials Transactions 43 1864-1867 | 2002 |
| 40 | Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–-Cu solder and thin film metallization | J.S Ha, T.S Oh and K.N Tu | Journal of Materials Research 18, 9 | 2003 |
| 41 | Electrical properties of the Pt/Sr0.85Bi2.4Ta2O9/TiO2/Si structure with variation of the Sr0.85Bi2.4Ta2O9 film thickness | J.W Kim, J.D Park, J.H Choi and T.S Oh | JOURNAL OF MATERIALS SCIENCE LETTERS 22, 535–537 | 2003 |
| 42 | Fabrication of tin oxide film by sol–.gel method for photovoltaic solar cell system | J.H Lee, T.S Oh, Y.H Kim and S.C Lee | Solar Energy Materials & Solar Cells 75 481–487 | 2003 |
| 43 | Electrical characteristics of Srx Bi2.4Ta2O9 thin film and Pt/Sr0.85Bi2.4Ta2O9/Al2O3/Si structure | J.W Kim, J.H Choi and T.S Oh | OURNAL OF MATERIALS SCIENCE 38 1853 – 1857 | 2003 |
| 44 | Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes | J.W Choi, H.S Cha and T.S Oh | Metals and Materials International, 9, 3, 273-278 | 2003 |
| 45 | Reaction between Sn-In Solder and Under Bump Metallurgy | J.H. Choi, B.Y. Jung, S.W. Jun, Y.H Kim, T.S Oh | Materials Science Forum 449-452, 401-404 | 2004 |
| 46 | Ferroelectric Characteristics of SrxBi2.4Ta2O9 Thin Films and Electrical Properties of the Pt/SrxBi2.4Ta2O9/TiO2/Si Structure | J.H. Choi, T.S Oh | Materials Science Forum, 449-452, 477-480 | 2004 |
| 47 | Electrodeposition of Bi2Te3 for Nanowire Application | Y.H. Lee, K.Y Lee, J.S Bae, J.H Lee, J.Y Byun, D.B. Hyun and T.S Oh | Materials Science Forum, 449-452, 377-380 | 2004 |
| 49 | Effects of Hydrogen Annealing on the Thermoelectric Properties of Electrodeposited Bi2Te3 for Nanowire Applications | S.W Jun, K.Y Lee and T.S Oh | Journal of Korean Physical Society 48 1708 | 2005 |
| 50 | Contact Resistance of the Chip-on-Glass Bonded 48Sn–.52In Solder Joint | J.H Choi, K.Y Lee, S.W Jun, Y.H Kim and T.S Oh | MATERIALS TRANSACTIONS 46(5) 1042-1046 | 2005 |
| 51 | Low Temperature and Ultra Fine Pitch Joints Using Non-Conductive Adhesive for Flip Chip Technology | W.J Lee, Y.H Kim, T.S Oh and S.Y Kim | 7th International Conference on Electronics Packaging Technology | 2006 |
| 52 | Fabrication and Evaluation of 3D Packages with Through Hole Via | D.M Jang, K.Y Lee, C.H Ryu, B.H Cho, T.S Oh, J.H Kim, W.J Lee and Jin Yu | MRS Proceedings Volume 970 | 2006 |
| 53 | P-Type and N-Type Bi2Te3/PbTe Functional Gradient Materials for Thermoelectric Power Generation | K.Y Lee and T.S Oh | Materials Science Forum 534-536, 1493-1496 | 2007 |
| 54 | Effects of the Additives and Current Density on the Electrodeposition Behavior and Mechanical Properties of the Ni-SiC Composite Coatings | T.S Oh, J.H Lee, J.Y Byun and T.S Oh | Key Engineering Materials 345-346 1533-1536 | 2007 |
| 55 | Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias | K.Y Lee, T.S Oh, J.H Lee and T.S Oh | Journal of Electronic Materials , Volume 36, Issue 2, pp 123-128 | 2007 |
| 56 | Bump Formation and Flip Chip Processes for RF System | B.Y Jung, E.K Choi, Y.S Jeon, K.Y Lee, K.S Seo and T.S Oh | Solid State Phenomena 124-126, 25-28 | 2007 |
| 56 | Bump Formation and Flip Chip Processes for RF System | B.Y Jung, E.K Choi, Y.S Jeon, K.Y Lee, K.S Seo and T.S Oh | Solid State Phenomena 124-126, 25-28 | 2007 |
| 57 | Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV) | D.M Jang, C.H Ryul, K.Y Lee, B.H Cho, J.H Kim, T.S Oh, W.J Lee and Jin Yu | Electronic Components and Technology Conference | 2007 |
| 58 | Thermoelectric Characteristics of the Electrodeposited (Bi,Sb)2Te3 Films with Variation of the Electrodeposition Current Density | T.J Yoon, Y.H Park and T.S Oh | Materials Science Forum 544-545, 917-920 | 2007 |
| 59 | Thermoelectric properties of the bismuth–antimony–telluride and the antimony–telluride films processed by electrodeposition for micro-device applications | S.K Lim, M.Y Kim and T.S Oh | The proceedings of the 1st International Conference on Microelectronics and Plasma Technology (ICMAP 2008) Volume 517 | 2008 |
| 60 | Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process | E.K. Choi, K.Y Lee and T.S Oh | 14th International Symposium on Intercalation Compounds — ISIC 14 | 2008 |
| 61 | Electrodeposition and mechanical properties of Ni–carbon nanotube nanocomposite coatings | Y.S. Jeon, J.Y Byun and T.S Oh | Journal of Physics and Chemistry of Solids 69 1391–1394 | 2008 |
| 62 | Flip-chip process using heat transfer from an induction-heating film | K.Y Lee, Y.H Lee, B.Y Jungand T.S Oh | Metals and Materials International, 15, 3, 479-485 | 2009 |
| 63 | Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package | Y. K. Jee, J Yu, K.W Park and T.S Oh | Journal of Electronic Materials Volume 38, Issue 5, pp 685-690 | 2009 |
| 64 | Thermoelectric Characteristics of p-Type (Bi,Sb)2Te3/(Pb,Sn)Te Functional Gradient Materials with Variation of the Segment Ratio | T.S Oh | Journal of Electronic Materials Volume 38, pp 1041-1047 | 2009 |
| 65 | Crystallization behavior and thermoelectric characteristics of the electrodeposited Sb2Te3 thin films | M.Y Kim and T.S Oh | Proceedings of the 2nd International Conference on Microelectronics and Plasma Technology – ICMAP 2009 Volume 518 | 2009 |
| 66 | Flip-Chip Process Using Interlocking-Bump Joints | K.Y Lee, H.J Won and T.S Oh | Components and Packaging Technologies, IEEE Transactions on Volume:32 | 2009 |
| 67 | Crystallization behavior and thermoelectric characteristics of the electrodeposited Sb2Te3 thin films | M.Y Park and T.S Oh | Thin Solid Films Volume 518 Pages 6550–6553 | 2010 |
| 68 | Thermoelectric energy-conversion characteristics of n-type Bi2(Te,Se)3 nanocomposites processed with carbon nanotube dispersion | D.H Park, M.Y Park and T.S Oh | International Conference on Electronic Materials and Nanotechnology for Green Environment Volume 11, Supplement,Pages S41–S45 | 2011 |
| 69 | Processing and Thermoelectric Performance Characterization of Thin-Film Devices Consisting of Electrodeposited Bismuth Telluride and Antimony Telluride Thin-Film Legs | M.Y Park and T.S Oh | Journal of Electronic Materials Volume 40 pp 759-764 | 2011 |
| 70 | Electrodeposition behavior and characteristics of Ni-carbon nanotube composite coatings | S.K Kim and T.S Oh | Transactions of Nonferrous Metals Society of China 21, 1, s68-s72 | 2011 |
| 71 | Carbon dioxide sensitivity of La-doped thick film tin oxide gas sensor | M.Y Park, J.M Bae and T.S Oh | The 7th Asian Meeting on Electroceramics (AMEC-7) in conjunction with the 7th Asian Meeting on Ferroelectricity (AMF-7) Volume 38, Supplement 1, Pages S657–S660 | 2012 |
| 72 | Thermoelectric characteristics of the (Bi,Sb)2(Te,Se)3 nanocomposites processed with nanoparticle dispersion | Y.H Yoe, D.H Park, M.Y Park and T.S Oh | The 7th Asian Meeting on Electroceramics (AMEC-7) in conjunction with the 7th Asian Meeting on Ferroelectricity (AMF-7) Volume 38, Supplement 1, Pages S529–S533 | 2012 |
| 73 | CO sensitivity of La2O3-doped SnO2 thick film gas sensor | J.Y Choi and T.S Oh | roceedings of the 4th International Conference on Microelectronics and Plasma Technology (ICMAP 2012) Volume 547, Pages 230–234 | 2013 |
| 74 | Thermoelectric Power Generation Characteristics of a Thin-Film Device Consisting of Electrodeposited n-Bi2Te3 and p-Sb2Te3 Thin-Film Legs | M.Y Park and T.S Oh | Journal of Electronic Materials Volume 42, pp 2752-2757 | 2013 |
| 75 | The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode Package | T. Joeng, J.S Ha, M.Y Park and T.S Oh | Journal of Electronic Materials Volume 43, pp 630-635 | 2014 |
| 76 | Preparation and Characterization of Bi2Te3/Sb2Te3 Thermoelectric Thin-Film Devices for Power Generation | M.Y Park and T.S Oh | Journal of Electronic Materials Volume 43, pp 1933-1939 | 2014 |
| 77 | Thermoelectric properties of p-type (Bi,Sb)2Te3 nanocomposites dispersed with multiwall carbon nanotubes | Y.H Yoe and T.S Oh | Proceedings of the IFFM2013 - Vol. 1: Fundamentals of the functional materials and Vol. 2: Applications of the functional materials Volume 58, Pages 54–58 | 2014 |
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